Flexibles Bornitrid-Faserpapier

Flexibles Bornitrid-Faserpapier

Flexibles Bornitrid-Faserpapier

Dimension: Customized
Materials: BN

  • Kundenspezifische Größen und Standardgrößen auf Lager
  • Schnelle Vorlaufzeit
  • Konkurrenzfähiger Preis

  • Flexible Boron Nitride Fiber Paper is a high-purity, lightweight material made from thermally stable fibers, offering excellent heat resistance, chemical inertness, and electrical insulation. Its uniform fiber network provides consistent performance and flexibility, making it suitable for high-temperature insulation, thermal management, and protective applications in advanced industries. As a leading supplier and manufacturer of premium boron nitride products, we can supply high-quality Flexible Boron Nitride Fiber Paper with various specifications and competitive prices, offering customized solutions to meet specific requirements.
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Flexible Boron Nitride Fiber Paper Data Sheet

Dimension:

Kundenspezifisch

Materialien:

BN

Flexible Boron Nitride Fiber Paper Description

Flexible Boron Nitride Fiber Paper is a high-performance material composed of thermally stable, lightweight fibers with outstanding chemical resistance and electrical insulation properties. It delivers consistent quality, superior heat resistance, and excellent flexibility, making it ideal for high-temperature insulation, thermal management, and protective applications in advanced industrial and research settings.

Flexibles Bornitrid-Faserpapier

Flexible Boron Nitride Fiber Paper Types

Boron Nitride Insulation Paper

Boron Nitride Insulation Paper is a high-purity, lightweight material designed for superior thermal stability, chemical resistance, and electrical insulation. Its uniform structure ensures consistent performance, making it suitable for high-temperature insulation, electronic components, and protective applications in advanced industrial settings.

Boron Nitride Insulation Paper

Test Item

Einheit

Standard Value

Tested Value

Basis Weight

g/m²

350 ± 20

352

Dicke

mm

0.45 ± 0.05

0.47

Zugfestigkeit

kN/m

≥ 1.0

1.2

Breakdown Strength

kV/mm

≥ 10

13

Volumenwiderstand

Ω·m

≥ 4×10⁶

4.5×10⁶

Moisture Content

%

≤ 3

1.0

Combustible Content

%

≤ 3

1.5

Minimum Bending Diameter

mm

—

60 (No breakage or cracks observed)

Wärmeleitfähigkeit

W/m-K

—

2.101

Boron Nitride White Ring Paper

Boron Nitride White Ring Paper is a high-purity, lightweight material made from thermally stable BN fibers, offering strong heat resistance, chemical inertness, and reliable electrical insulation. Its smooth, uniform structure provides consistent performance and easy processing, making it suitable for high-temperature insulation, electronic components, and specialized industrial applications.

Boron Nitride White Ring Paper
Boron Nitride White Ring Paper

Test Item

Einheit

Standard Value

Tested Value

Basis Weight

g/m²

350 ± 20

352

Dicke

mm

0.45 ± 0.05

0.47

Zugfestigkeit

kN/m

≥ 1.0

1.2

Breakdown Strength

kV/mm

≥ 10

13

Volumenwiderstand

Ω·m

≥ 4×10⁶

4.5×10⁶

Moisture Content

%

≤ 3

1.0

Combustible Content

%

≤ 3

1.5

Minimum Bending Diameter

mm

—

60 (No breakage or cracks observed)

Wärmeleitfähigkeit

W/m-K

—

2.101

Boron Nitride Release Paper

Boron Nitride Release Paper is a high-purity, lightweight material engineered to deliver excellent thermal stability, chemical resistance, and clean release performance. Its uniform BN fiber structure prevents sticking during high-temperature processing, making it suitable for sintering, metal casting, and composite manufacturing.

Boron Nitride Release Paper
Boron Nitride Release Paper

Test Item

Einheit

GTBNFP-R(70011000)

GTBNFP-R(90131006)

Standard Value

Tested Value

Standard Value

Tested Value

Basis Weight

g/m²

160 ± 15

159

290 ± 20

289

Dicke

mm

0.35 ± 0.03

0.34

0.40 ± 0.04

0.41

Zugfestigkeit

kN/m

≥ 0.2

0.3

≥ 0.5

0.8

Breakdown Voltage

kV/mm

≥ 10

14

≥ 10

12.58

Volumenwiderstand

Ω·m

4 × 10⁸

8.9 × 10⁸

4 × 10⁸

1.0 × 10¹³

Moisture Content

%

≤ 1

0.6

≤ 1

0.6

Combustible Content

%

≤ 3

2.0

≤ 16

13.4

Minimum Bending Radius

mm

/

20

/

20

Boron Nitride Insulating Coating Paper

Boron Nitride Insulating Coating Paper is a high-purity material made from BN fibers that offers strong thermal stability, chemical resistance, and dependable electrical insulation. Its smooth, uniform surface allows for clean application as a protective coating layer in high-temperature and electrical environments, making it suitable for furnaces, electronic components, and advanced manufacturing processes.

Boron Nitride Insulating Coating Paper
Boron Nitride Insulating Coating Paper

Test Item

Einheit

Standard Value

Tested Value

Basis Weight

g/m²

160 ± 15

159

Dicke

mm

0.25 ± 0.02

0.24

Zugfestigkeit

kN/m

≥ 1.0

1.3

Dielektrische Festigkeit

kV/mm

≥ 10

12

Volumenwiderstand

Ω·m

≥ 4 × 10⁸

7.1 × 10⁸

Moisture Content

%

≤ 1

0.6

Combustible Content

%

≤ 10

9.0

Minimum Bending Radius

mm

/

20

Flexible Boron Nitride Fiber Paper Applications

  • High-Temperature Insulation: Provides stable thermal protection for furnaces, heaters, and other equipment exposed to extreme temperatures.
  • Electronic Insulation: Acts as a lightweight, non-conductive barrier in electronic devices, sensors, and high-voltage components.
  • Composite Manufacturing: Serves as a reinforcement or release layer in composite fabrication, ensuring clean processing and improved stability.
  • Thermal Management: Used in devices that require efficient heat spreading or shielding without adding significant weight.
  • Luft- und Raumfahrt & Automotive: Supports lightweight thermal protection and heat-shielding applications in demanding aerospace and automotive environments.
  • Aerospace Applications
    Luft- und Raumfahrt
  • Elektrischer und elektronischer Bereich
    Elektrischer und elektronischer Bereich
  • Autoindustrie
    Autoindustrie
  • Electronic Insulation
    Electronic Insulation
  • High Temperature Insulation
    High Temperature Insulation

Materialeigenschaften von Bornitrid

Artikel

Einheit

Note A

Klasse AX05

Klasse HP

Besoldungsgruppe M26

Klasse ZSBN

HMBN1000

HMBN2000

HMBN3000

HMBN4000

HMBN5000

Dichte

g/cm³

2.0

1.9

2.0

2.1

2.9

1.9

2.1

1.9

1.85-2.05

2.0

Druckfestigkeit

MPa

143 ∥ / 186 ⟂

25 ∥

96 ∥

–

219 ∥ / 254 ⟂

40 ∥ / 40 ⟂

312 ∥ / 312 ⟂

24 ∥

95 ∥

–

Biegefestigkeit

MPa

94 ∥ / 65 ⟂

22 ∥ / 21 ⟂

59 ∥ / 45 ⟂

62 ∥ / 34 ⟂

144 ∥ / 107 ⟂

13 ∥ / 29 ⟂

>49

21 ∥ / 20 ⟂

58 ∥ / 44 ⟂

61 ∥ / 33 ⟂

Elastizitätsmodul

GPa

47 ∥ / 74 ⟂

17 ∥ / 71 ⟂

40 ∥ / 60 ⟂

–

–

–

–

45 ∥ / 73 ⟂

39 ∥ / 58 ⟂

–

Querkontraktionszahl

MPa

94 ∥ / 65 ⟂

22 ∥ / 21 ⟂

59 ∥ / 45 ⟂

62 ∥ / 34 ⟂

144 ∥ / 107 ⟂

14 ∥ / 30 ⟂

< 50

20 ∥ / 20 ⟂

50 ∥ / 50 ⟂

50 ∥ / 50 ⟂

Artikel

Einheit

Note A

Klasse AX05

Klasse HP

Besoldungsgruppe M26

Klasse ZSBN

HMBN1000

HMBN2000

HMBN3000

HMBN4000

HMBN5000

Wärmeleitfähigkeit

W/mK

30 ∥ / 34 ⟂

78 ∥ / 130 ⟂

27 ∥ / 29 ⟂

11 ∥ / 29 ⟂

24 ∥ / 34 ⟂

21 ∥ / 21 ⟂

–

73 ∥ / 128 ⟂

27 ∥ / 29 ⟂

11 ∥ / 26 ⟂

Maximale Temperatur (oxidierend)

°C

850

850

850

1000+

850

850

850

850

850

1000

Maximale Temperatur (inert)

°C

1200

2000

1150

1000+

1600

2000

1000

2000

1200

1000

CTE 25°C ➞ 400°C

10⁻⁶/K

3.0 ∥ / 3.0 ⟂

-2.3 ∥ / -0.7 ⟂

0.6 ∥ / 0.4 ⟂

3.0 ∥ / 0.4 ⟂

4.1 ∥ / 3.4 ⟂

–

–

-2.3 ∥ / -0.7 ⟂

0.6 ∥ / 0.4 ⟂

3.0 ∥ / 0.4 ⟂

CTE 400°C ➞ 800°C

10⁻⁶/K

2.0 ∥ / 1.4 ⟂

-2.5 ∥ / 1.1 ⟂

1.1 ∥ / 0.8 ⟂

2.5 ∥ / 0.1 ⟂

5.6 ∥ / 4.3 ⟂

–

–

-2.5 ∥ / 1.1 ⟂

1.1 ∥ / 0.8 ⟂

5.6 ∥ / 4.3 ⟂

CTE 800°C ➞ 1200°C

10⁻⁶/K

1.9 ∥ / 1.8 ⟂

1.6 ∥ / 0.4 ⟂

1.5 ∥ / 0.9 ⟂

3.0 ∥ / 0.1 ⟂

7.2 ∥ / 5.2 ⟂

–

–

1.6 ∥ / 0.4 ⟂

1.5 ∥ / 0.9 ⟂

7.2 ∥ / 5.2 ⟂

CTE 1200°C ➞ 1600°C

10⁻⁶/K

5.0 ∥ / 4.8 ⟂

0.9 ∥ / 0.3 ⟂

2.8 ∥ / 2.7 ⟂

–

4.6 ∥ / 3.4 ⟂

–

–

0.9 ∥ / 0.3 ⟂

2.8 ∥ / 2.7 ⟂

4.6 ∥ / 3.4 ⟂

CTE 1600°C ➞ 1900°C

10⁻⁶/K

7.2 ∥ / 6.1 ⟂

0.5 ∥ / 0.9 ⟂

–

–

–

–

–

0.5 ∥ / 0.9 ⟂

–

–

CTE 25°C ➞ 1000°C

10⁻⁶/K

–

–

–

–

–

5.5 ∥ / 1 ⟂

2.5 ∥ / 2.0 ⟂

–

–

–

Artikel

Einheit

Note A

Klasse AX05

Klasse HP

Besoldungsgruppe M26

Klasse ZSBN

HMBN1000

HMBN2000

HMBN3000

HMBN4000

HMBN5000

Dielektrische Festigkeit

kV/mm

88

79

>10

66

3.5

>40

–

>40

>40

>40

Dielektrizitätskonstante

1 MHz

4.6 ∥ / 4.2 ⟂

4.0 ∥ / 4.0 ⟂

4.3 ∥ / 4.0 ⟂

4.5 ∥ / 3.8 ⟂

18 ∥ / 19 ⟂

–

–

4.0 ∥ / 4.0 ⟂

4.3 ∥ / 4.0 ⟂

4.5 ∥ / 3.8 ⟂

Dissipationsfaktor

1 MHz

1.2×10⁻³ ∥ / 3.4×10⁻³ ⟂

1.2×10⁻³ ∥ / 3.0×10⁻³ ⟂

1.5×10⁻³ ∥ / 2.1×10⁻³ ⟂

1.7×10⁻³ ∥ / 6.7×10⁻³ ⟂

4.5×10⁻² ∥ / 6.7×10⁻² ⟂

–

–

1.2×10⁻³ ∥ / 3.0×10⁻⁴ ⟂

1.5×10⁻³ ∥ / 2.1×10⁻³ ⟂

1.7×10⁻³ ∥ / 6.7×10⁻³ ⟂

Volume Resistivity @25°C

ohm-cm

>10¹³ ∥ / 10¹⁴ ⟂

>10¹³ ∥ / 10¹⁴ ⟂

>10¹³ ∥ / 10¹³ ⟂

>10¹³ ∥ / 10¹⁴ ⟂

>10¹³ ∥ / 10¹² ⟂

>10¹⁴

–

>10¹³ ∥ / 10¹⁴ ⟂

>10¹³ ∥ / 10¹³ ⟂

>10¹³ ∥ / 10¹⁴ ⟂

Bornitrid-Werkstoffsorten

Grade A is the standard boron nitride ceramic grade, sintered with a calcium borate binder. It offers excellent electrical insulation, good thermal conductivity, and outstanding machinability, making it the most widely used BN grade for general industrial applications.

Klasse

Einführung

Wichtige Eigenschaften

Note A

Standard hBN grade; calcium borate binder; density 2.0 g/cm³

– Compressive strength: 143 ∥ / 186 ⟂ MPa
– Flexural strength: 94 ∥ / 65 ⟂ MPa
– Thermal conductivity: 30 ∥ / 34 ⟂ W/mK
– Max service temp: 850°C oxidizing, 1200°C inert
– Dielectric strength: 88 kV/mm; resistivity >10¹³ ohm-cm

Grade AX05 is engineered for applications demanding extremely high thermal conductivity. The highly oriented hBN microstructure delivers outstanding in-plane thermal performance, making it ideal for thermal management substrates and heat-spreader components operating up to 2000°C in inert atmospheres.

Klasse

Einführung

Wichtige Eigenschaften

Klasse AX05

High thermal conductivity hBN; highly oriented microstructure; density 1.9 g/cm³

– Thermal conductivity: 78 ∥ / 130 ⟂ W/mK (exceptional)
– Flexural strength: 22 ∥ / 21 ⟂ MPa
– Max service temp: 850°C oxidizing, 2000°C inert
– CTE: −2.3 ∥ / −0.7 ⟂ ×10⁻⁶/K (25–400°C)
– Dielectric strength: 79 kV/mm

Grade HP is a high-purity boron nitride grade with a binder-free composition. Its excellent chemical inertness and purity make it the preferred choice for semiconductor processing, crystal growth crucibles, and applications requiring minimal contamination.

Klasse

Einführung

Wichtige Eigenschaften

Klasse HP

High-purity hBN; binder-free composition; density 2.0 g/cm³

– Compressive strength: 96 ∥ MPa
– Flexural strength: 59 ∥ / 45 ⟂ MPa
– Thermal conductivity: 27 ∥ / 29 ⟂ W/mK
– Max service temp: 850°C oxidizing, 1150°C inert
– Dielectric strength: >10 kV/mm; resistivity >10¹³ ohm-cm

Grade M26 is a modified boron nitride grade engineered for superior moisture resistance—over 10 times more resistant to humidity than standard grades. Its unique binder system maintains stable electrical and thermal properties in humid operating environments, with an extended oxidizing service temperature above 1000°C.

Klasse

Einführung

Wichtige Eigenschaften

Besoldungsgruppe M26

Moisture-resistant modified hBN; unique binder system; density 2.1 g/cm³

– Flexural strength: 62 ∥ / 34 ⟂ MPa
– Thermal conductivity: 11 ∥ / 29 ⟂ W/mK
– Max service temp: 1000+°C oxidizing, 1000+°C inert
– 10× moisture resistance vs. standard grades
– Dielectric strength: 66 kV/mm

Grade ZSBN is a zirconia-reinforced boron nitride composite offering the highest mechanical strength in the BN product family. The ZrO₂ reinforcement significantly improves compressive and flexural strength while retaining BN’s excellent machinability and electrical insulation properties.

Klasse

Einführung

Wichtige Eigenschaften

Klasse ZSBN

Zirconia-reinforced hBN composite; ZrO₂ binder; density 2.9 g/cm³

– Compressive strength: 219 ∥ / 254 ⟂ MPa (highest in range)
– Flexural strength: 144 ∥ / 107 ⟂ MPa (highest in range)
– Thermal conductivity: 24 ∥ / 34 ⟂ W/mK
– Max service temp: 850°C oxidizing, 1600°C inert
– Dielectric strength: 3.5 kV/mm

HMBN1000 is a premium-grade hBN material in the HMBN series, offering ultra-high-temperature stability up to 2000°C in inert atmospheres. Its exceptionally high volume resistivity makes it well-suited for demanding electrical insulation in high-temperature vacuum environments.

Klasse

Einführung

Wichtige Eigenschaften

HMBN1000

hBN premium grade; high-temp stability; density 1.9 g/cm³

– Compressive strength: 40 ∥ / 40 ⟂ MPa
– Flexural strength: 13 ∥ / 29 ⟂ MPa
– Thermal conductivity: 21 ∥ / 21 ⟂ W/mK
– Max service temp: 850°C oxidizing, 2000°C inert
– Volume resistivity: >10¹⁴ ohm-cm

HMBN2000 is an HMBN-series grade combining high density with exceptional compressive strength. Its superior structural integrity makes it a preferred choice for high-load applications in metallurgical processing and advanced industrial environments.

Klasse

Einführung

Wichtige Eigenschaften

HMBN2000

High-strength HMBN grade; high-density composite; density 2.1 g/cm³

– Compressive strength: 312 ∥ / 312 ⟂ MPa (highest in HMBN series)
– Flexural strength: >49 MPa
– Max service temp: 850°C oxidizing, 1000°C inert
– High isotropy: equal compressive strength in all directions

HMBN3000 delivers outstanding in-plane thermal conductivity within the HMBN series, offering performance comparable to Grade AX05. It is specifically formulated for high-temperature thermal management applications where both conductivity and inert atmosphere stability are critical.

Klasse

Einführung

Wichtige Eigenschaften

HMBN3000

High thermal conductivity HMBN grade; oriented microstructure; density 1.9 g/cm³

– Thermal conductivity: 73 ∥ / 128 ⟂ W/mK (top in HMBN series)
– Compressive strength: 24 ∥ MPa
– Flexural strength: 21 ∥ / 20 ⟂ MPa
– Max service temp: 850°C oxidizing, 2000°C inert
– CTE: −2.3 ∥ / −0.7 ⟂ ×10⁻⁶/K

HMBN4000 is a versatile mid-range HMBN-series grade offering a balanced combination of thermal, electrical, and mechanical properties. Its density range (1.85–2.05 g/cm³) accommodates slight microstructural variation while maintaining consistent performance across semiconductor and high-temperature process applications.

Klasse

Einführung

Wichtige Eigenschaften

HMBN4000

Versatile HMBN grade; balanced properties; density 1.85–2.05 g/cm³

– Compressive strength: 95 ∥ MPa
– Flexural strength: 58 ∥ / 44 ⟂ MPa
– Thermal conductivity: 27 ∥ / 29 ⟂ W/mK
– Max service temp: 850°C oxidizing, 1200°C inert
– Dielectric strength: >40 kV/mm

HMBN5000 is the premium ultra-high-purity grade of the HMBN series. Engineered with stringent quality controls, it minimizes trace contamination for the most demanding semiconductor and photovoltaic process environments, while delivering consistent mechanical and thermal performance in critical applications.

Klasse

Einführung

Wichtige Eigenschaften

HMBN5000

Ultra-high-purity HMBN grade; premium composite; density 2.0 g/cm³

– Thermal conductivity: 11 ∥ / 26 ⟂ W/mK
– Flexural strength: 61 ∥ / 33 ⟂ MPa
– Max service temp: 1000°C oxidizing, 1000°C inert
– Dielectric strength: >40 kV/mm; resistivity >10¹³ ohm-cm
– Ideal for semiconductor, solar (PV), and defense precision parts

Bornitrid-Bearbeitung

Boron Nitride Machining Center

Das Bearbeitungszentrum von Advanced Ceramic Hub ist mit mehreren CNC-Drehbänken und CNC-Fräsmaschinen ausgestattet und verfügt über umfangreiche Erfahrung in der Bearbeitung. Wir bieten maßgeschneiderte Bornitrid-Keramikprodukte und -profile mit extrem engen Toleranzen, die auf die Kundenanforderungen zugeschnitten sind. Während des Bearbeitungsprozesses sollten die folgenden Vorsichtsmaßnahmen beachtet werden:

  • Bornitrid-Keramikwerkstoffe können mit Standard-Schnellstahlwerkzeugen bearbeitet werden. Für härtere und Verbundwerkstoffe werden Hartmetall- oder Diamantwerkzeuge empfohlen.
  • Schleifarbeiten können nach Bedarf durchgeführt werden, und für die Bearbeitung von Gewinden können Standardgewindebohrer und Schneideisen verwendet werden.
  • Der Bearbeitungsprozess sollte stets trocken erfolgen, ohne dass Schneidöle oder Kühlmittel verwendet werden müssen.
  • Schneidewerkzeuge sollten scharf und sauber sein, und Werkzeuge mit negativem Spanwinkel sollten nicht verwendet werden.
  • Beim Einspannen und Sichern von Materialien ist darauf zu achten, dass kein übermäßiger Druck ausgeübt wird. Um Kanten- und Eckausbrüche zu vermeiden, sollten Steigfrästechniken verwendet werden.

Bornitrid-Verpackungen

Bornitrid-Keramikprodukte werden in der Regel in vakuumversiegelten Beuteln verpackt, um Feuchtigkeit oder Verunreinigungen zu vermeiden, und mit Schaumstoff umwickelt, um Erschütterungen und Stöße während des Transports abzufedern und die Qualität der Produkte in ihrem ursprünglichen Zustand zu gewährleisten.

Ceramic Products Packing

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Wir werden das prüfen und uns innerhalb von 24 Stunden bei Ihnen melden.

To customize your Flexible Boron Nitride Fiber Paper, please provide the following details:

  1. Abmessungen: Specify the desired length, width, and thickness.
  2. Paper Type: Insulation Paper, White Ring Paper, Release Paper, or Insulating Coating Paper.
  3. Anmeldung: Describe the intended use environment (temperature range, chemical exposure, etc.).
  4. Menge: Number of pieces or area required.

Once we have these details, we can provide you with a tailored quote within 24 hours.

Wir haben eine Vielzahl von Bornitridprodukten auf Lager, für die in der Regel keine Mindestbestellmenge erforderlich ist. Für kundenspezifische Aufträge setzen wir jedoch in der Regel einen Mindestbestellwert von $200 fest. Die Vorlaufzeit für Lagerartikel beträgt in der Regel 1-2 Wochen, während Sonderanfertigungen in der Regel 3-4 Wochen dauern, je nach den Besonderheiten des Auftrags.

Flexible Boron Nitride Fiber Paper exhibits excellent thermal stability and maintains its structural integrity at temperatures up to 1000°C in oxidizing atmospheres and up to 1800°C in inert or vacuum environments. It does not melt or drip, making it ideal for sustained high-temperature applications.

No. Flexible Boron Nitride Fiber Paper is an excellent electrical insulator. It has a high volume resistivity and high dielectric strength, making it suitable for use in high-voltage electronic components and electrical insulation applications.

Advanced Ceramics Hub, established in 2016 in Colorado, USA, is a specialized supplier and manufacturer of advanced ceramic products. With extensive expertise in supply and export, we offer competitive pricing and customized solutions tailored to specific requirements, ensuring outstanding quality and customer satisfaction. As a professional provider of ceramics, refractory metals, specialty alloys, spherical powders, and various advanced materials, we serve the research, development, and large-scale industrial production needs of the scientific and industrial sectors.

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