Flexible Boron Nitride Fiber Paper

Dimension: Customized
Materials: BN

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Flexible Boron Nitride Fiber Paper is a high-purity, lightweight material made from thermally stable fibers, offering excellent heat resistance, chemical inertness, and electrical insulation. Its uniform fiber network provides consistent performance and flexibility, making it suitable for high-temperature insulation, thermal management, and protective applications in advanced industries. As a leading supplier and manufacturer of premium boron nitride products, we can supply high-quality Flexible Boron Nitride Fiber Paper with various specifications and competitive prices, offering customized solutions to meet specific requirements.

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Flexible Boron Nitride Fiber Paper Data Sheet

Dimension:	Customized
Materials:	BN

Flexible Boron Nitride Fiber Paper Description

Flexible Boron Nitride Fiber Paper is a high-performance material composed of thermally stable, lightweight fibers with outstanding chemical resistance and electrical insulation properties. It delivers consistent quality, superior heat resistance, and excellent flexibility, making it ideal for high-temperature insulation, thermal management, and protective applications in advanced industrial and research settings.

Flexible Boron Nitride Fiber Paper Types

Boron Nitride Insulation Paper

Boron Nitride Insulation Paper is a high-purity, lightweight material designed for superior thermal stability, chemical resistance, and electrical insulation. Its uniform structure ensures consistent performance, making it suitable for high-temperature insulation, electronic components, and protective applications in advanced industrial settings.

Test Item	Unit	Standard Value	Tested Value
Basis Weight	g/m²	350 ± 20	352
Thickness	mm	0.45 ± 0.05	0.47
Tensile Strength	kN/m	≥ 1.0	1.2
Breakdown Strength	kV/mm	≥ 10	13
Volume Resistivity	Ω·m	≥ 4×10⁶	4.5×10⁶
Moisture Content	%	≤ 3	1.0
Combustible Content	%	≤ 3	1.5
Minimum Bending Diameter	mm	—	60 (No breakage or cracks observed)
Thermal Conductivity	W/m·K	—	2.101

Boron Nitride White Ring Paper

Boron Nitride White Ring Paper is a high-purity, lightweight material made from thermally stable BN fibers, offering strong heat resistance, chemical inertness, and reliable electrical insulation. Its smooth, uniform structure provides consistent performance and easy processing, making it suitable for high-temperature insulation, electronic components, and specialized industrial applications.

Test Item	Unit	Standard Value	Tested Value
Basis Weight	g/m²	350 ± 20	352
Thickness	mm	0.45 ± 0.05	0.47
Tensile Strength	kN/m	≥ 1.0	1.2
Breakdown Strength	kV/mm	≥ 10	13
Volume Resistivity	Ω·m	≥ 4×10⁶	4.5×10⁶
Moisture Content	%	≤ 3	1.0
Combustible Content	%	≤ 3	1.5
Minimum Bending Diameter	mm	—	60 (No breakage or cracks observed)
Thermal Conductivity	W/m·K	—	2.101

Boron Nitride Release Paper

Boron Nitride Release Paper is a high-purity, lightweight material engineered to deliver excellent thermal stability, chemical resistance, and clean release performance. Its uniform BN fiber structure prevents sticking during high-temperature processing, making it suitable for sintering, metal casting, and composite manufacturing.

Test Item	Unit	GTBNFP-R(70011000)		GTBNFP-R(90131006)
Test Item	Unit	Standard Value	Tested Value	Standard Value	Tested Value
Basis Weight	g/m²	160 ± 15	159	290 ± 20	289
Thickness	mm	0.35 ± 0.03	0.34	0.40 ± 0.04	0.41
Tensile Strength	kN/m	≥ 0.2	0.3	≥ 0.5	0.8
Breakdown Voltage	kV/mm	≥ 10	14	≥ 10	12.58
Volume Resistivity	Ω·m	4 × 10⁸	8.9 × 10⁸	4 × 10⁸	1.0 × 10¹³
Moisture Content	%	≤ 1	0.6	≤ 1	0.6
Combustible Content	%	≤ 3	2.0	≤ 16	13.4
Minimum Bending Radius	mm	/	20	/	20

Boron Nitride Insulating Coating Paper

Boron Nitride Insulating Coating Paper is a high-purity material made from BN fibers that offers strong thermal stability, chemical resistance, and dependable electrical insulation. Its smooth, uniform surface allows for clean application as a protective coating layer in high-temperature and electrical environments, making it suitable for furnaces, electronic components, and advanced manufacturing processes.

Test Item	Unit	Standard Value	Tested Value
Basis Weight	g/m²	160 ± 15	159
Thickness	mm	0.25 ± 0.02	0.24
Tensile Strength	kN/m	≥ 1.0	1.3
Dielectric Strength	kV/mm	≥ 10	12
Volume Resistivity	Ω·m	≥ 4 × 10⁸	7.1 × 10⁸
Moisture Content	%	≤ 1	0.6
Combustible Content	%	≤ 10	9.0
Minimum Bending Radius	mm	/	20

Flexible Boron Nitride Fiber Paper Applications

High-Temperature Insulation: Provides stable thermal protection for furnaces, heaters, and other equipment exposed to extreme temperatures.
Electronic Insulation: Acts as a lightweight, non-conductive barrier in electronic devices, sensors, and high-voltage components.
Composite Manufacturing: Serves as a reinforcement or release layer in composite fabrication, ensuring clean processing and improved stability.
Thermal Management: Used in devices that require efficient heat spreading or shielding without adding significant weight.
Aerospace & Automotive: Supports lightweight thermal protection and heat-shielding applications in demanding aerospace and automotive environments.

Aerospace
Electrical and Electronic Area
Automotive Industry
Electronic Insulation
High Temperature Insulation

Boron Nitride Material Properties

Items	Unit	Grade A	Grade AX05	Grade HP	Grade M26	Grade ZSBN	HMBN1000	HMBN2000	HMBN3000	HMBN4000	HMBN5000
Density	g/cm³	2.0	1.9	2.0	2.1	2.9	1.9	2.1	1.9	1.85-2.05	2.0
Compressive Strength	MPa	143 ∥ / 186 ⟂	25 ∥	96 ∥	–	219 ∥ / 254 ⟂	40 ∥ / 40 ⟂	312 ∥ / 312 ⟂	24 ∥	95 ∥	–
Flexural Strength	MPa	94 ∥ / 65 ⟂	22 ∥ / 21 ⟂	59 ∥ / 45 ⟂	62 ∥ / 34 ⟂	144 ∥ / 107 ⟂	13 ∥ / 29 ⟂	>49	21 ∥ / 20 ⟂	58 ∥ / 44 ⟂	61 ∥ / 33 ⟂
Young's Modulus	GPa	47 ∥ / 74 ⟂	17 ∥ / 71 ⟂	40 ∥ / 60 ⟂	–	–	–	–	45 ∥ / 73 ⟂	39 ∥ / 58 ⟂	–
Poisson's Ratio	MPa	94 ∥ / 65 ⟂	22 ∥ / 21 ⟂	59 ∥ / 45 ⟂	62 ∥ / 34 ⟂	144 ∥ / 107 ⟂	14 ∥ / 30 ⟂	< 50	20 ∥ / 20 ⟂	50 ∥ / 50 ⟂	50 ∥ / 50 ⟂

Items	Unit	Grade A	Grade AX05	Grade HP	Grade M26	Grade ZSBN	HMBN1000	HMBN2000	HMBN3000	HMBN4000	HMBN5000
Thermal Conductivity	W/mK	30 ∥ / 34 ⟂	78 ∥ / 130 ⟂	27 ∥ / 29 ⟂	11 ∥ / 29 ⟂	24 ∥ / 34 ⟂	21 ∥ / 21 ⟂	–	73 ∥ / 128 ⟂	27 ∥ / 29 ⟂	11 ∥ / 26 ⟂
Max Temp (Oxidizing)	°C	850	850	850	1000+	850	850	850	850	850	1000
Max Temp (Inert)	°C	1200	2000	1150	1000+	1600	2000	1000	2000	1200	1000
CTE 25°C ➞ 400°C	10⁻⁶/K	3.0 ∥ / 3.0 ⟂	-2.3 ∥ / -0.7 ⟂	0.6 ∥ / 0.4 ⟂	3.0 ∥ / 0.4 ⟂	4.1 ∥ / 3.4 ⟂	–	–	-2.3 ∥ / -0.7 ⟂	0.6 ∥ / 0.4 ⟂	3.0 ∥ / 0.4 ⟂
CTE 400°C ➞ 800°C	10⁻⁶/K	2.0 ∥ / 1.4 ⟂	-2.5 ∥ / 1.1 ⟂	1.1 ∥ / 0.8 ⟂	2.5 ∥ / 0.1 ⟂	5.6 ∥ / 4.3 ⟂	–	–	-2.5 ∥ / 1.1 ⟂	1.1 ∥ / 0.8 ⟂	5.6 ∥ / 4.3 ⟂
CTE 800°C ➞ 1200°C	10⁻⁶/K	1.9 ∥ / 1.8 ⟂	1.6 ∥ / 0.4 ⟂	1.5 ∥ / 0.9 ⟂	3.0 ∥ / 0.1 ⟂	7.2 ∥ / 5.2 ⟂	–	–	1.6 ∥ / 0.4 ⟂	1.5 ∥ / 0.9 ⟂	7.2 ∥ / 5.2 ⟂
CTE 1200°C ➞ 1600°C	10⁻⁶/K	5.0 ∥ / 4.8 ⟂	0.9 ∥ / 0.3 ⟂	2.8 ∥ / 2.7 ⟂	–	4.6 ∥ / 3.4 ⟂	–	–	0.9 ∥ / 0.3 ⟂	2.8 ∥ / 2.7 ⟂	4.6 ∥ / 3.4 ⟂
CTE 1600°C ➞ 1900°C	10⁻⁶/K	7.2 ∥ / 6.1 ⟂	0.5 ∥ / 0.9 ⟂	–	–	–	–	–	0.5 ∥ / 0.9 ⟂	–	–
CTE 25°C ➞ 1000°C	10⁻⁶/K	–	–	–	–	–	5.5 ∥ / 1 ⟂	2.5 ∥ / 2.0 ⟂	–	–	–

Items	Unit	Grade A	Grade AX05	Grade HP	Grade M26	Grade ZSBN	HMBN1000	HMBN2000	HMBN3000	HMBN4000	HMBN5000
Dielectric Strength	kV/mm	88	79	>10	66	3.5	>40	–	>40	>40	>40
Dielectric Constant	1 MHz	4.6 ∥ / 4.2 ⟂	4.0 ∥ / 4.0 ⟂	4.3 ∥ / 4.0 ⟂	4.5 ∥ / 3.8 ⟂	18 ∥ / 19 ⟂	–	–	4.0 ∥ / 4.0 ⟂	4.3 ∥ / 4.0 ⟂	4.5 ∥ / 3.8 ⟂
Dissipation Factor	1 MHz	1.2×10⁻³ ∥ / 3.4×10⁻³ ⟂	1.2×10⁻³ ∥ / 3.0×10⁻³ ⟂	1.5×10⁻³ ∥ / 2.1×10⁻³ ⟂	1.7×10⁻³ ∥ / 6.7×10⁻³ ⟂	4.5×10⁻² ∥ / 6.7×10⁻² ⟂	–	–	1.2×10⁻³ ∥ / 3.0×10⁻⁴ ⟂	1.5×10⁻³ ∥ / 2.1×10⁻³ ⟂	1.7×10⁻³ ∥ / 6.7×10⁻³ ⟂
Volume Resistivity @25°C	ohm-cm	>10¹³ ∥ / 10¹⁴ ⟂	>10¹³ ∥ / 10¹⁴ ⟂	>10¹³ ∥ / 10¹³ ⟂	>10¹³ ∥ / 10¹⁴ ⟂	>10¹³ ∥ / 10¹² ⟂	>10¹⁴	–	>10¹³ ∥ / 10¹⁴ ⟂	>10¹³ ∥ / 10¹³ ⟂	>10¹³ ∥ / 10¹⁴ ⟂

Boron Nitride Material Grades

Grade A is the standard boron nitride ceramic grade, sintered with a calcium borate binder. It offers excellent electrical insulation, good thermal conductivity, and outstanding machinability, making it the most widely used BN grade for general industrial applications.

Grade	Introduction	Key Properties
Grade A	Standard hBN grade; calcium borate binder; density 2.0 g/cm³	– Compressive strength: 143 ∥ / 186 ⟂ MPa – Flexural strength: 94 ∥ / 65 ⟂ MPa – Thermal conductivity: 30 ∥ / 34 ⟂ W/mK – Max service temp: 850°C oxidizing, 1200°C inert – Dielectric strength: 88 kV/mm; resistivity >10¹³ ohm-cm

Grade AX05 is engineered for applications demanding extremely high thermal conductivity. The highly oriented hBN microstructure delivers outstanding in-plane thermal performance, making it ideal for thermal management substrates and heat-spreader components operating up to 2000°C in inert atmospheres.

Grade	Introduction	Key Properties
Grade AX05	High thermal conductivity hBN; highly oriented microstructure; density 1.9 g/cm³	– Thermal conductivity: 78 ∥ / 130 ⟂ W/mK (exceptional) – Flexural strength: 22 ∥ / 21 ⟂ MPa – Max service temp: 850°C oxidizing, 2000°C inert – CTE: −2.3 ∥ / −0.7 ⟂ ×10⁻⁶/K (25–400°C) – Dielectric strength: 79 kV/mm

Grade HP is a high-purity boron nitride grade with a binder-free composition. Its excellent chemical inertness and purity make it the preferred choice for semiconductor processing, crystal growth crucibles, and applications requiring minimal contamination.

Grade	Introduction	Key Properties
Grade HP	High-purity hBN; binder-free composition; density 2.0 g/cm³	– Compressive strength: 96 ∥ MPa – Flexural strength: 59 ∥ / 45 ⟂ MPa – Thermal conductivity: 27 ∥ / 29 ⟂ W/mK – Max service temp: 850°C oxidizing, 1150°C inert – Dielectric strength: >10 kV/mm; resistivity >10¹³ ohm-cm

Grade M26 is a modified boron nitride grade engineered for superior moisture resistance—over 10 times more resistant to humidity than standard grades. Its unique binder system maintains stable electrical and thermal properties in humid operating environments, with an extended oxidizing service temperature above 1000°C.

Grade	Introduction	Key Properties
Grade M26	Moisture-resistant modified hBN; unique binder system; density 2.1 g/cm³	– Flexural strength: 62 ∥ / 34 ⟂ MPa – Thermal conductivity: 11 ∥ / 29 ⟂ W/mK – Max service temp: 1000+°C oxidizing, 1000+°C inert – 10× moisture resistance vs. standard grades – Dielectric strength: 66 kV/mm

Grade ZSBN is a zirconia-reinforced boron nitride composite offering the highest mechanical strength in the BN product family. The ZrO₂ reinforcement significantly improves compressive and flexural strength while retaining BN’s excellent machinability and electrical insulation properties.

Grade	Introduction	Key Properties
Grade ZSBN	Zirconia-reinforced hBN composite; ZrO₂ binder; density 2.9 g/cm³	– Compressive strength: 219 ∥ / 254 ⟂ MPa (highest in range) – Flexural strength: 144 ∥ / 107 ⟂ MPa (highest in range) – Thermal conductivity: 24 ∥ / 34 ⟂ W/mK – Max service temp: 850°C oxidizing, 1600°C inert – Dielectric strength: 3.5 kV/mm

HMBN1000 is a premium-grade hBN material in the HMBN series, offering ultra-high-temperature stability up to 2000°C in inert atmospheres. Its exceptionally high volume resistivity makes it well-suited for demanding electrical insulation in high-temperature vacuum environments.

Grade	Introduction	Key Properties
HMBN1000	hBN premium grade; high-temp stability; density 1.9 g/cm³	– Compressive strength: 40 ∥ / 40 ⟂ MPa – Flexural strength: 13 ∥ / 29 ⟂ MPa – Thermal conductivity: 21 ∥ / 21 ⟂ W/mK – Max service temp: 850°C oxidizing, 2000°C inert – Volume resistivity: >10¹⁴ ohm-cm

HMBN2000 is an HMBN-series grade combining high density with exceptional compressive strength. Its superior structural integrity makes it a preferred choice for high-load applications in metallurgical processing and advanced industrial environments.

Grade	Introduction	Key Properties
HMBN2000	High-strength HMBN grade; high-density composite; density 2.1 g/cm³	– Compressive strength: 312 ∥ / 312 ⟂ MPa (highest in HMBN series) – Flexural strength: >49 MPa – Max service temp: 850°C oxidizing, 1000°C inert – High isotropy: equal compressive strength in all directions

HMBN3000 delivers outstanding in-plane thermal conductivity within the HMBN series, offering performance comparable to Grade AX05. It is specifically formulated for high-temperature thermal management applications where both conductivity and inert atmosphere stability are critical.

Grade	Introduction	Key Properties
HMBN3000	High thermal conductivity HMBN grade; oriented microstructure; density 1.9 g/cm³	– Thermal conductivity: 73 ∥ / 128 ⟂ W/mK (top in HMBN series) – Compressive strength: 24 ∥ MPa – Flexural strength: 21 ∥ / 20 ⟂ MPa – Max service temp: 850°C oxidizing, 2000°C inert – CTE: −2.3 ∥ / −0.7 ⟂ ×10⁻⁶/K

HMBN4000 is a versatile mid-range HMBN-series grade offering a balanced combination of thermal, electrical, and mechanical properties. Its density range (1.85–2.05 g/cm³) accommodates slight microstructural variation while maintaining consistent performance across semiconductor and high-temperature process applications.

Grade	Introduction	Key Properties
HMBN4000	Versatile HMBN grade; balanced properties; density 1.85–2.05 g/cm³	– Compressive strength: 95 ∥ MPa – Flexural strength: 58 ∥ / 44 ⟂ MPa – Thermal conductivity: 27 ∥ / 29 ⟂ W/mK – Max service temp: 850°C oxidizing, 1200°C inert – Dielectric strength: >40 kV/mm

HMBN5000 is the premium ultra-high-purity grade of the HMBN series. Engineered with stringent quality controls, it minimizes trace contamination for the most demanding semiconductor and photovoltaic process environments, while delivering consistent mechanical and thermal performance in critical applications.

Grade	Introduction	Key Properties
HMBN5000	Ultra-high-purity HMBN grade; premium composite; density 2.0 g/cm³	– Thermal conductivity: 11 ∥ / 26 ⟂ W/mK – Flexural strength: 61 ∥ / 33 ⟂ MPa – Max service temp: 1000°C oxidizing, 1000°C inert – Dielectric strength: >40 kV/mm; resistivity >10¹³ ohm-cm – Ideal for semiconductor, solar (PV), and defense precision parts

Boron Nitride Machining

The Advanced Ceramic Hub machining center is equipped with multiple CNC lathes and CNC milling machines, backed by extensive machining experience. We offer customized boron nitride ceramic products and profiles with extremely tight tolerances, tailored to customer requirements. During the machining process, the following precautions should be observed:

Boron nitride ceramic materials can be machined using standard high-speed steel cutting tools. For harder and composite materials, carbide or diamond tools are recommended.
Grinding operations can be performed as needed, and standard taps and dies can be used to machine threads.
The machining process should always be kept dry, with no need for cutting oils or coolants.
Cutting tools should be sharp and clean, and tools with negative rake angles should not be used.
Care should be taken when clamping and securing materials to avoid applying excessive pressure. Climb milling techniques should be used to prevent edge and corner chipping.

Boron Nitride Packaging

Boron Nitride Ceramic products are typically packaged in vacuum-sealed bags to prevent moisture or contamination, wrapped with foam to cushion vibrations and impacts during transport, ensuring the quality of products in their original condition.

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Boron Nitride Data Sheet_PDS
SAFETY DATA SHEET (SDS) – Flexible Boron Nitride Fiber Paper

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To customize your Flexible Boron Nitride Fiber Paper, please provide the following details:

Dimensions: Specify the desired length, width, and thickness.
Paper Type: Insulation Paper, White Ring Paper, Release Paper, or Insulating Coating Paper.
Application: Describe the intended use environment (temperature range, chemical exposure, etc.).
Quantity: Number of pieces or area required.

Once we have these details, we can provide you with a tailored quote within 24 hours.

We carry a wide variety of boron nitride products in stock, and for these, there is generally no minimum order requirement. However, for custom orders, we typically set a minimum order value of $200. The lead time for stock items is usually 1-2 weeks, while custom orders usually take 3-4 weeks, depending on the specifics of the order.

Flexible Boron Nitride Fiber Paper exhibits excellent thermal stability and maintains its structural integrity at temperatures up to 1000°C in oxidizing atmospheres and up to 1800°C in inert or vacuum environments. It does not melt or drip, making it ideal for sustained high-temperature applications.

No. Flexible Boron Nitride Fiber Paper is an excellent electrical insulator. It has a high volume resistivity and high dielectric strength, making it suitable for use in high-voltage electronic components and electrical insulation applications.

Advanced Ceramics Hub, established in 2016 in Colorado, USA, is a specialized supplier and manufacturer of advanced ceramic products. With extensive expertise in supply and export, we offer competitive pricing and customized solutions tailored to specific requirements, ensuring outstanding quality and customer satisfaction. As a professional provider of ceramics, refractory metals, specialty alloys, spherical powders, and various advanced materials, we serve the research, development, and large-scale industrial production needs of the scientific and industrial sectors.

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Flexible Boron Nitride Fiber Paper

Flexible Boron Nitride Fiber Paper

Flexible Boron Nitride Fiber Paper Data Sheet

Flexible Boron Nitride Fiber Paper Description