Carcasa de aluminio y carburo de silicio

Aluminum Silicon Carbide Shell Data Sheet

Fórmula química:	Al-SiC
Forma:	Shell
Dimensión:	Estándar o personalizado

Aluminum Silicon Carbide Shell Description

Aluminum Silicon Carbide Shell serves as an advanced solution for hermetic tube packaging, offering a unique combination of high thermal conductivity, low density, and mechanical strength. By replacing heavier traditional metal and ceramic materials, it effectively reduces the overall weight of the package, enhances heat dissipation efficiency, and lowers production costs. Its stability and reliability under demanding operating conditions make it an excellent choice for applications in power electronics, high-frequency microwave systems, optoelectronic conversion devices, communication base station amplifiers, and hybrid circuit modules. This material’s balanced performance profile enables higher power densities, longer service life, and improved efficiency in critical electronic systems.

Material de carburo de aluminio y silicio Composición química

Tecnología	Código de referencia del material	Fracción de volumen		Ventajas de rendimiento	Instrucciones para la solicitud
		SiC (%)	Al (%)
RSPM + HIP (Solidificación rápida + HIP)	HMA15	15	85	✔Alta resistencia específica y rigidez ✔Baja densidad ✔Excelente resistencia al desgaste ✔Buena resistencia al calor	✔ Componentes ligeros y resistentes al desgaste ✔Alternativa a las aleaciones de aluminio, acero fundido, hierro fundido y aleaciones de titanio ✔Componentes de frenos, pistones, bielas, aletas ventrales de cazas, piezas forjadas de rotores de helicópteros.
	HMA30	30	70
	HMA40	40	60	✔Alta resistencia específica y rigidez ✔Alto límite elástico ✔Baja expansión térmica ✔Alta conductividad térmica	✔Aplicaciones aeroespaciales y de defensa ✔Espejos ópticos, componentes del sistema de navegación inercial ✔Alternativa al berilio, vitrocerámica, vidrio de cuarzo
	HMA50	50	50
Infiltración a presión (PI)	HMA55	55	45	✔Alto módulo específico ✔Baja densidad ✔Baja expansión térmica ✔Alta conductividad térmica	✔Materiales de gestión térmica para uso militar y civil ✔Sustratos militares IGBT, sustratos PCB, placas base de disipación de calor ✔Bases y carcasas de componentes electrónicos, bases y carcasas de módulos amplificadores de potencia ✔Alternativa a las aleaciones W/Cu, Mo/Cu, Kovar
	HMA65	65	35
	HMA70	70	30

Aluminum Silicon Carbide Shell Features

• Alta conductividad térmica: Efficiently dissipates heat to maintain optimal operating temperatures in high-power applications.
• Estructura ligera: Significantly reduces overall packaging weight compared to traditional metal or ceramic shells.
• Cost-Effective: Lowers manufacturing and material costs while maintaining high performance and reliability.
• Excelente resistencia mecánica: Provides robust structural support and durability under demanding operating conditions.
• Wide Application Compatibility: Suitable for power electronics, microwave systems, optoelectronic devices, and hybrid circuit modules.

Aluminum Silicon Carbide Shell Applications

• Electrónica de potencia: Used in high-power modules and converters to improve heat dissipation and reduce system weight.
• Electrical Power Systems: Applied in protection and control devices for enhanced thermal management and reliability.
• Power Microwave Devices: Provides stable packaging for radar, satellite communication, and high-frequency systems.
• Optoelectronic Conversion Equipment: Supports efficient heat transfer in laser diodes, LEDs, and photovoltaic modules.
• Communication Base Station Amplifiers: Ensures long-term stability and performance in RF and signal amplification units.