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Thermal-Conductive Boron Nitride Fiber
Thermal-Conductive Boron Nitride Fiber offers outstanding thermal management performance thanks to its highly oriented fiber structure, which delivers strong axial heat conduction while maintaining the classic electrical insulation and chemical stability of h-BN. This material provides a lightweight, high-temperature-resistant solution for advanced thermal interface and heat-dissipation applications. As a leading supplier and manufacturer of premium boron nitride products, we can supply high-quality Thermal-Conductive Boron Nitride Fiber with various specifications and competitive prices, offering customized solutions to meet specific requirements.
Ou envoyez-nous un courriel à l'adresse suivante sales@heegermaterials.com.Thermal-Conductive Boron Nitride Fiber Data Sheet
| Longueur : | 300 ± 5 mm or customized |
| Width: | 240 ± 5 mm or customized |
Thermal-Conductive Boron Nitride Fiber
Thermal-Conductive Boron Nitride Fiber is engineered to deliver efficient heat transfer in demanding environments, combining high axial thermal conductivity with low dielectric properties and excellent high-temperature resistance. Its lightweight structure and stable performance make it a reliable choice for next-generation thermal management materials across electronics, communication equipment, and high-power devices.
Thermal-Conductive Boron Nitride Fiber Specifications
| Propriété | Spécifications |
|---|---|
| Taille (mm) | Length × Width = (300 ± 5) mm × (240 ± 5) mm |
| Fiber Diameter (μm) | 15 ± 3 |
| Densité apparente (g/cm³) | 1.8 ± 0.2 |
| Conductivité thermique (W/m-K) | ≥ 80 |
Thermal-Conductive Boron Nitride Fiber Applications
- 5G/6G Communication Base Stations: Used as thermal management material to dissipate heat from high-power electronics.
- Electric Vehicles & Batteries: Provides efficient heat conduction in battery packs and electronic components.
- Électronique de puissance : Acts as a thermally conductive, electrically insulating filler in devices requiring high heat dissipation.
- Composants aérospatiaux : Applied in thermal interface materials and lightweight heat-dissipating structures.
- Advanced Thermal Composites: Incorporated into polymer, ceramic, or metal composites to enhance axial heat conductivity while maintaining electrical insulation.
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