How to Break the Impasse in Cooling for Future High-Performance Chips
Next-generation high-performance computing, AI accelerator GPUs, and RF power devices are pushing heat fluxes past 100 W/cm²—with hot spots exceeding 1,000 W/cm². Traditional copper and aluminum heat sinks are hitting a hard physical limitation: high thermal expansion mismatch with silicon/SiC chips causes solder fatigue, while electrical conductivity limits direct attachment. To break this cooling impasse,…
