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Quartz Nozzle
Quartz Nozzle is a high-purity, heat-resistant component commonly used in semiconductor, plasma, and chemical processing equipment. It offers excellent thermal stability, low thermal expansion, and strong resistance to chemical corrosion, making it suitable for use in harsh environments involving high temperatures and aggressive gases. Its precision design ensures smooth gas or fluid flow, reducing contamination and improving system performance. We can supply high-quality quartz nozzle for etching equipment with various specifications and competitive prices, offering customized solutions to meet specific requirements.
Or email us at sales@heegermaterials.com.Quartz Nozzle Data Sheet
| Color: | White – transparent |
| Shape: | Customized |
| Dimension(inch): | Customized |
| Chemical Formula: | SiO2 |
Quartz Nozzle Description
Quartz nozzle is made from high-purity fused silica and is valued for its ability to withstand extreme thermal and chemical conditions. It maintains structural integrity under rapid heating and cooling cycles, making it suitable for demanding applications such as etching, CVD, and high-temperature spraying systems. Its non-reactive surface minimizes particle generation and contamination, ensuring clean operation in critical environments.
Quartz Nozzle Features
- High thermal resistance, suitable for continuous use in high-temperature environments
- Excellent chemical stability against acids and plasma corrosion
- Low thermal expansion, minimizing cracking under rapid temperature changes
- High purity (typically >99.99% SiO₂), ensuring minimal contamination
- Smooth inner surface for uniform gas or fluid flow
Quartz Nozzle Applications
- Semiconductor Manufacturing: Used in plasma etching, CVD, and diffusion systems
- Chemical Vapor Deposition (CVD): Delivers gases uniformly in high-temperature chambers
- Industrial Spraying Systems: Applies coatings or treatments in high-temperature processes
- Fiber Optics Production: Controls gas or material flow in drawing towers
- Laboratory and Research Equipment: Provides precision gas control in high-purity experiments
Quartz Ceramic Material Properties
| Purity (%) | >99.8 | >99.5 |
| Density (g/cm3) | 1.9-1.95 | 1.9-1.95 |
| Flexture strength (MPa) | 28 | 28 |
| Compressive strength (MPa) | >50 | >50 |
| Bending strength (MPa) | 25 | 25 |
| Maximum working temperature (℃) | 1650 | 1650 |
| Thermal conductivity (W/m*K) | <1 | <1 |
| Thermal expansion coefficient (/℃) | 8.5*10-7 | 8.5*10-7 |
| number of use | ≥10 | ≥10 |
Quartz Ceramic Material Machining
Quartz ceramic material can be machined in its green or bisque state before sintering, making it easier to shape into complex forms. Like other ceramics, it shrinks by about 15–20% during sintering, so this must be considered in the initial design. After sintering, quartz ceramic becomes extremely hard and brittle, making machining very difficult and requiring diamond-coated tools and high-precision equipment.
Machining Methods and Considerations
- Green or Bisque Machining: Quartz ceramic is easier to cut and shape before sintering, making it suitable for intricate designs.
- Sintering Shrinkage: Expect a 15–20% size reduction during sintering, which affects dimensional accuracy.
- Post-Sintering Machining: After sintering, quartz becomes hard and brittle, requiring diamond tools and precise control.
- Fragility: Fully sintered quartz ceramic is prone to chipping or cracking if mishandled.
- Tooling and Time: Machining sintered quartz is slow and requires specialized equipment.
Quartz Ceramic Packaging
Quartz ceramic products are typically packaged in vacuum-sealed bags to prevent moisture or contamination and wrapped with foam to cushion vibrations and impacts during transport, ensuring the quality of products in their original condition.
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