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Beryllium Oxide Substrate
Beryllium Oxide Substrate offers excellent thermal conductivity and electrical insulation, making it ideal for high-performance electronic applications. It supports thick-film metallization through active metal methods such as Mo-Mn or W-Mn, followed by nickel plating and pattern etching to form precise circuits. This makes it widely used in microwave power circuits and integrated circuits where heat dissipation and reliability are critical. We can supply high-quality Beryllium Oxide Sustrate with various specifications and competitive prices, offering customized solutions to meet specific requirements.
Or email us at sales@heegermaterials.com.Beryllium Oxide Substrate Data Sheet
| Color: | White |
| Chemical Formula: | BeO |
| Dimension: | customized |
| Machining Accuracy: | 0.01 mm |
| Surface Roughness: | 0.1 μm |
Beryllium Oxide Substrate Description
Beryllium Oxide Substrate, also known as BeO ceramic substrate, is engineered for demanding electronic applications requiring superior heat management and strong dielectric properties. Using active metallization processes like molybdenum-manganese (Mo-Mn) or tungsten-manganese (W-Mn), a robust thick-film metal layer is applied to the surface. After nickel plating and fine-pattern etching, the resulting circuit layer achieves excellent solderability and structural integrity, with tensile strength exceeding 20 MPa. Even under reducing atmospheres at around 800 °C, the nickel layer remains stable without blistering. This makes BeO substrates a dependable platform in high-frequency, high-power electronics, especially in aerospace and telecommunication systems.
Beryllium Oxide Substrate Chemical Compositions
| Element | Content (ppm) |
|---|---|
| Boron (B) | 2 |
| Aluminum (Al) | 46 |
| Chromium (Cr) | 8 |
| Iron (Fe) | 32 |
| Magnesium (Mg) | 1000 |
| Manganese (Mn) | 2 |
| Nickel (Ni) | 9 |
| Titanium (Ti) | 5 |
| Sodium (Na) | 173 |
| Calcium (Ca) | 31 |
| Silicon (Si) | 2100 |
Beryllium Oxide Substrate Features
- Exceptional Thermal Conductivity: Offers outstanding heat dissipation with thermal conductivity up to 280 W/m·K, far exceeding most ceramic materials.
- High Mechanical and Electrical Strength: Combines high dielectric strength with excellent puncture resistance, ensuring stability under demanding electrical loads.
- Low Dielectric Constant and Loss: Maintains low dielectric constant and minimal high-frequency loss, making it ideal for RF and microwave applications.
- Advanced Hot Pressing Process: Manufactured using precision hot-pressing technology, delivering dense, crack-free substrates with consistent quality.
- Flexible Customization: Available in a wide range of shapes, sizes, and thicknesses to meet specific design requirements for power devices and hybrid circuits.
Beryllium Oxide Substrate Applications
- High-Power Electronic Packaging: Used in RF power transistors, microwave devices, and laser diode modules, offering excellent thermal conductivity to ensure stable device operation.
- Aerospace and Military Radar Systems: Ideal for high-reliability radar modules and electronic warfare systems due to its superior thermal management and electrical insulation.
- Semiconductor Testing Equipment: Applied in high-frequency test platforms to reduce dielectric loss and improve signal accuracy.
- Medical Imaging and Treatment Devices: Utilized in components like CT tubes and X-ray emitters where high thermal conductivity and electrical insulation are essential.
- Optoelectronics and Communication Modules: Supports high-frequency, high-speed data transmission in optical modules by providing reliable thermal dissipation.
Beryllium Oxide Ceramic Properties
Beryllium Oxide Ceramic Material Machining
Beryllium Oxide (BeO) Ceramic is valued for its exceptional thermal conductivity, electrical insulation, and high melting point. These qualities make it widely used in electronics and high-temperature applications, but its hardness and brittleness require special machining approaches. Key machining considerations include:
- Cutting: Precision diamond-coated tools or laser cutting are essential to avoid microcracks and maintain clean edges, as BeO’s brittleness can lead to chipping during conventional cutting.
- Grinding: Fine diamond grinding wheels enable accurate shaping and surface finishing while minimizing the risk of fractures, especially important for small or complex parts.
- Drilling: Ultrasonic machining or abrasive waterjet methods are preferred to produce precise holes without causing thermal damage or cracks.
- Surface Finishing: Polishing techniques enhance surface smoothness and electrical insulation properties, crucial for applications demanding high dielectric performance and reliability.
Beryllium Oxide Ceramic Packaging
Beryllium oxide ceramic products are typically packaged in vacuum-sealed bags to prevent moisture or contamination and wrapped with foam to cushion vibrations and impacts during transport, ensuring the quality of products in their original condition.
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