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Beryllium Oxide Plate/Sheet/Disc
Beryllium Oxide Plate/Sheet/Disc features outstanding thermal conductivity up to 325 W/(m·K), making it ideal for dissipating intense heat in high-power electronic applications. Its low dielectric constant (6.7) and stable thermal expansion enable reliable performance in compact, high-frequency circuits. Compared to materials like AlN and Al2O3, BeO delivers superior heat management, often serving as a key component in microwave devices and advanced thermal interfaces. We can supply high-quality Beryllium Oxide Plate/Sheet/Disc with various specifications and competitive prices, offering customized solutions to meet specific requirements.
Or email us at sales@heegermaterials.com.Beryllium Oxide Plate/Sheet/Disc Data Sheet
| Color: | White |
| Chemical Formula: | BeO |
| Dimension: | customized |
| Machining Accuracy: | 0.01 mm |
| Surface Roughness: | 0.1 μm |
Beryllium Oxide Plate/Sheet/Disc Description
Beryllium Oxide Plate/Sheet/Disc is a high-performance ceramic material known for its unique combination of thermal, electrical, and mechanical properties. It offers excellent heat dissipation, high dielectric strength, and chemical stability, making it a preferred choice for demanding thermal management applications. Unlike traditional ceramics, BeO maintains electrical insulation while efficiently conducting heat, which is essential for high-frequency and high-density electronic circuits. Its compatibility with semiconductor materials like silicon and its ability to withstand high operating temperatures allow engineers to design compact and reliable systems in telecommunications, aerospace, and military-grade electronics.
Beryllium Oxide Plate 
Beryllium Oxide Sheet 
Beryllium Oxide Disc
Beryllium Oxide Plate/Sheet/Disc Chemical Compositions
| Element | Content (ppm) |
|---|---|
| Boron (B) | 2 |
| Aluminum (Al) | 46 |
| Chromium (Cr) | 8 |
| Iron (Fe) | 32 |
| Magnesium (Mg) | 1000 |
| Manganese (Mn) | 2 |
| Nickel (Ni) | 9 |
| Titanium (Ti) | 5 |
| Sodium (Na) | 173 |
| Calcium (Ca) | 31 |
| Silicon (Si) | 2100 |
Beryllium Oxide Plate/Sheet/Disc Features
- Ultra-High Thermal Conductivity: Offers thermal conductivity up to 325 W/(m·K), making it one of the most efficient ceramic heat spreaders—second only to diamond.
- Excellent Electrical Insulation: Combines high thermal performance with strong electrical insulation, ideal for high-power and high-frequency electronic applications.
- Low Dielectric Constant: With a dielectric constant of 6.7, BeO supports stable signal transmission in RF and microwave circuits.
- Thermal Expansion Compatibility: Its thermal expansion closely matches that of silicon, making it suitable for use in semiconductor assemblies and hybrid circuits.
- High Purity and Stability: Manufactured to standards like Thermalox 995, it ensures consistent performance, chemical resistance, and reliability in harsh environments.
Beryllium Oxide Plate/Sheet/Disc Applications
- Medical Lasers and Imaging Systems: Used in high-power gas lasers for DNA analysis and fluorescence microscopy, where precise thermal control is critical for accuracy and stability.
- Telecommunication Base Stations: Integrated into resistors, transistors, and power amplifiers to efficiently manage heat in high-frequency, high-power RF systems.
- Industrial Laser Equipment: Serves as a thermal substrate in laser diode assemblies and metal-cutting or marking systems, improving device lifespan and performance.
- Semiconductor Handling Tools: Utilized in wafer chucks, end-effectors, and crucibles for high-temperature processes due to its thermal shock resistance and material stability.
- Defense and Aerospace Electronics: Critical in radar, guidance systems, and microwave communication modules where compact design and high thermal efficiency are essential for mission-critical reliability.
Beryllium Oxide Ceramic Properties
Beryllium Oxide Ceramic Material Machining
Beryllium Oxide (BeO) Ceramic is valued for its exceptional thermal conductivity, electrical insulation, and high melting point. These qualities make it widely used in electronics and high-temperature applications, but its hardness and brittleness require special machining approaches. Key machining considerations include:
- Cutting: Precision diamond-coated tools or laser cutting are essential to avoid microcracks and maintain clean edges, as BeO’s brittleness can lead to chipping during conventional cutting.
- Grinding: Fine diamond grinding wheels enable accurate shaping and surface finishing while minimizing the risk of fractures, especially important for small or complex parts.
- Drilling: Ultrasonic machining or abrasive waterjet methods are preferred to produce precise holes without causing thermal damage or cracks.
- Surface Finishing: Polishing techniques enhance surface smoothness and electrical insulation properties, crucial for applications demanding high dielectric performance and reliability.
Beryllium Oxide Ceramic Packaging
Beryllium oxide ceramic products are typically packaged in vacuum-sealed bags to prevent moisture or contamination and wrapped with foam to cushion vibrations and impacts during transport, ensuring the quality of products in their original condition.
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