Aluminum Nitride Sputtering Target
Aluminum Nitride Sputtering Target
Purity: 99.5%-99.9%
Aluminum Nitride Sputtering Target is made from high-purity aluminum oxide with uniform composition and dense structure, widely used in thin film deposition and the semiconductor industry. As a leading supplier and manufacturer of premium aluminum nitride products, we can supply high-quality aluminum nitride sputtering targets with various specifications and competitive prices, offering customized solutions to meet specific requirements.
Or email us at sales@heegermaterials.com.Aluminum Nitride Sputtering Target Data Sheet
| Reference Code: | HMST457 |
| Purity: | 99.5%-99.9% |
| Density: | 3.26 g/cm3 |
| Appearance: | Bluish White, Crystalline Solid |
| Shape: | Rectangular, Disc, or Tube |
| Bonding Service: | Unbonding, or Bonding |
| Melting Point: | >2200℃ |
| Z Ratio: | 1.00 |
| Sputter: | RF-R |
| Max Power Density: | 20 W/in² |
Aluminum Nitride Sputtering Target
Aluminum Nitride (AlN) Sputtering Target is a high-performance ceramic sputtering target material, featuring exceptional thermal conductivity, electrical resistivity, and hardness. Its uniform composition and dense structure make it ideal for producing smooth, defect-free films through magnetron sputtering or ion beam deposition. They are widely used in microelectronics, optoelectronics, and photovoltaics. Advanced Ceramics Hub can provide customized solutions in terms of purity, size, density, and other parameters to meet diverse industrial and research applications.
Aluminum Nitride Sputtering Target Specifications
| Circular Sputtering Targets | Diameter | 1.0″ 2.0″ 3.0″ 4.0″ 5.0″ 6.0″ up to 21″ |
| Rectangular Sputtering Targets | Width x Length | 5” x 12″ 5” x 15″ 5” x 20″ 5” x 22″ 6” x 20″ |
| Thickness | 0.125″, 0.25″ | |
Aluminum Nitride Sputtering Target Features
- High purity and density
- Low particle
- Uniform film thickness distribution
- High efficiency in the use
Aluminum Nitride Sputtering Target Applications
- Semiconductor Industry: The aluminum nitride (AlN) sputtering target is commonly used in thin-film deposition for insulating and passivation layers and as a buffer layer in GaN-based devices (e.g., HEMTs).
- Optoelectronics: The aluminum nitride (AlN) sputtering target is the key material for UV LEDs and laser diodes due to its wide bandgap (6.2 eV) and transparency to ultraviolet light.
- Acoustic Wave Devices: Deposited as piezoelectric films for surface acoustic wave (SAW) and bulk acoustic wave (BAW) sensors/resonators in 5G/6G filters.
- Protective Coatings: The aluminum nitride (AlN) sputtering target can provide wear-resistant and thermally stable coatings for aerospace/components.
- Thermal Management: High thermal conductivity (~320 W/m·K) makes it ideal for heat dissipation in high-power electronics.
Aluminum Nitride Sputtering Target Quality Control
Raw Material Composition Analysis
Impurities are analyzed using ICP and GDMS for metals, and carbon-sulfur and nitrogen-oxygen analyzers for non-metals, ensuring purity meets required standards.
Metallographic Inspection
Detection equipment is used to inspect the target material for internal defects or shrinkage holes, while metallographic testing ensures the grain structure is fine and dense.
Appearance and Dimensional Inspection
Micrometers and calipers measure dimensions, while a cleanliness instrument checks surface smoothness and cleanliness.
Aluminum Nitride Material Properties
Aluminum Nitride Material Grades
HMAN1000 is our standard high purity aluminium nitride with a thermal conductivity of 170 W/mK. This is the same thermal performance as our substrate material but offers the possibility of larger pieces in length/width and in thicknesses up to 30mm.
HMAN1000 has good coefficient of thermal expansion – matched to silicon and gallium nitride over wide temperature ranges.
HMAN100 Applications:
- High power insulators
- Laser components
- Water cooled heatsinks
- Power electronics
- Aerospace, medical and semiconductor components
HMAN1000S 170 W/mK is our standard high thermal conductivity substrate material, However, other high-performance grades are also available.
HMAN1000S Applications:
- Heat sinks
- Heat spreaders
- Laser heatsinks power rectifiers
- Aerospace, power electronics, rectifiers
HMAN2000 is one of our enhanced grades of aluminium nitride, offering all the mechanical performance of HMAN1000 with the enhanced benefits of 200 W/mK thermal conductance.
HMAN2000 Applications:
- Heat sinks
- Heat spreaders
- Laser heatsinks power rectifiers
- Aerospace, power electronics, rectifiers
HMAN3000 is one of our enhanced grades of aluminium nitride offering, all the mechanical performance of HMAN1000 with the enhanced benefits of 230 W/mK thermal conductance.
HMAN3000 Applications:
- Heat sinks
- Heat spreaders
- Laser heatsinks power rectifiers
- Aerospace, power electronics, rectifiers
HMAN4000 is one of our enhanced grades of aluminium nitride offering, all the mechanical performance of HMAN1000 with the enhanced benefits of 200 W/mK thermal conductance.
HMAN4000 Applications:
- Heat sinks
- Heat spreaders
- Laser heatsinks power rectifiers
- Aerospace, power electronics, rectifiers
Aluminum Nitride Ceramic Machining
Aluminum Nitride (AlN) ceramic machining is a precise process used to fabricate high-performance components from aluminum nitride materials. Machining aluminum nitride ceramics requires specialized equipment and techniques to handle their brittleness and hardness. Proper tooling and controlled environments are essential to avoid material damage and achieve the desired surface finish and dimensional accuracy. The common machining methods are as follows:
- Diamond Cutting: Diamond tools are used to achieve fine precision and smooth surface finishes, ideal for complex shapes.
- Laser Cutting: A non-contact method used for intricate shapes, with high precision and minimal thermal impact.
- Precision Grinding: Utilized to achieve fine tolerances and surface finishes. Requires special care to prevent cracking or chipping due to the ceramic’s brittleness.
- Wire EDM (Electrical Discharge Machining): A method often used for intricate cutting, especially for thin and complex geometries.
Aluminum Nitride Ceramic Packaging
Aluminum Nitride Ceramic products are typically packaged in vacuum-sealed bags to prevent moisture or contamination and wrapped with foam to cushion vibrations and impacts during transport, ensuring the quality of products in their original condition.
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