Aluminum Silicon Carbide Shell

Aluminum Silicon Carbide Shell Data Sheet

Chemical Formula:	Al-SiC
Shape:	Shell
Dimension:	Standard or customized

Aluminum Silicon Carbide Shell Description

Aluminum Silicon Carbide Shell serves as an advanced solution for hermetic tube packaging, offering a unique combination of high thermal conductivity, low density, and mechanical strength. By replacing heavier traditional metal and ceramic materials, it effectively reduces the overall weight of the package, enhances heat dissipation efficiency, and lowers production costs. Its stability and reliability under demanding operating conditions make it an excellent choice for applications in power electronics, high-frequency microwave systems, optoelectronic conversion devices, communication base station amplifiers, and hybrid circuit modules. This material’s balanced performance profile enables higher power densities, longer service life, and improved efficiency in critical electronic systems.

Aluminum Silicon Carbide Material Chemical Composition

Technology	Material Reference Code	Volume Fraction		Performance Advantages	Application Directions
		SiC (%)	Al (%)
RSPM + HIP (Rapid Solidification + HIP)	HMA15	15	85	✔High specific strength & stiffness ✔Low density ✔Excellent wear resistance ✔Good heat resistance	✔Lightweight and wear-resistant components ✔Alternative to aluminum alloys, cast steel, cast iron, and titanium alloys ✔Brake components, pistons, connecting rods, fighter belly fins, helicopter rotor forgings
	HMA30	30	70
	HMA40	40	60	✔High specific strength & stiffness ✔High micro-yield strength ✔Low thermal expansion ✔High thermal conductivity	✔Aerospace and defense applications ✔Optical mirrors, inertial navigation system components ✔Alternative to beryllium, glass-ceramics, quartz glass
	HMA50	50	50
Pressure Infiltration (PI)	HMA55	55	45	✔High specific modulus ✔Low density ✔Low thermal expansion ✔High thermal conductivity	✔Thermal management materials for military and civilian use ✔Military IGBT substrates, PCB substrates, heat dissipation baseplates ✔Electronic component bases and housings, power amplifier module housings and bases ✔Alternative to W/Cu, Mo/Cu, Kovar alloys
	HMA65	65	35
	HMA70	70	30

Aluminum Silicon Carbide Shell Features

• High Thermal Conductivity: Efficiently dissipates heat to maintain optimal operating temperatures in high-power applications.
• Lightweight Structure: Significantly reduces overall packaging weight compared to traditional metal or ceramic shells.
• Cost-Effective: Lowers manufacturing and material costs while maintaining high performance and reliability.
• Excellent Mechanical Strength: Provides robust structural support and durability under demanding operating conditions.
• Wide Application Compatibility: Suitable for power electronics, microwave systems, optoelectronic devices, and hybrid circuit modules.

Aluminum Silicon Carbide Shell Applications

• Power Electronics: Used in high-power modules and converters to improve heat dissipation and reduce system weight.
• Electrical Power Systems: Applied in protection and control devices for enhanced thermal management and reliability.
• Power Microwave Devices: Provides stable packaging for radar, satellite communication, and high-frequency systems.
• Optoelectronic Conversion Equipment: Supports efficient heat transfer in laser diodes, LEDs, and photovoltaic modules.
• Communication Base Station Amplifiers: Ensures long-term stability and performance in RF and signal amplification units.