Aluminum Nitride Plate/Sheet/Disc
Aluminum Nitride Plate/Sheet/Disc
Purity: 95%-99%
Aluminum Nitride Plate/Sheet/Disc is a high-performance ceramic material with exceptional thermal conductivity, electrical insulation, and high-temperature resistance. It is widely used in electronic heat dissipation, semiconductor equipment, and high-temperature industries. As a leading supplier and manufacturer of premium aluminum nitride products, we can supply high-quality aluminum nitride plates, sheets, and discs with various specifications and competitive prices, offering customized solutions to meet specific requirements.
Or email us at sales@heegermaterials.com.Aluminum Nitride Plate/Sheet/Disc Data Sheet
Reference Code: | HM1918 |
Purity: | 95%-99% |
Density: | 3.32 g/cm3 |
Appearance: | Dark Gray / Light Gray / Beige |
Aluminum Nitride Plate/Sheet/Disc
Aluminum Nitride Plate/Sheet/Disc has a thermal expansion coefficient similar to silicon, allowing it to perfectly match electronic modules during temperature changes. Due to its excellent electrical insulation and dielectric properties, aluminum nitride plate/sheet/disc is ideal for large-scale integrated circuits or high-power modules. It is manufactured through a die-casting process and high-temperature sintering, featuring zero porosity, excellent flatness, and surface smoothness. Advanced Ceramics Hub can supply customized solutions in width, length, thickness, and surface finish to meet diverse industrial and research requirements.
Aluminum Nitride (AlN) Plate Aluminum Nitride (AlN) Sheet Aluminum Nitride (AlN) Disc
Aluminum Nitride Plate/Sheet/Disc Advantages
- High thermal conductivity (170-230 W/mK), up to 9.5 times that of alumina.
- A thermal expansion coefficient similar to that of silicon (Si).
- Superior electrical insulation and lower dielectric constant.
- Higher mechanical strength (450 MPa).
- Excellent resistance to molten metal corrosion.
- High purity and non-toxic.
Aluminum Nitride Plate/Sheet/Disc Applications
- Thermal Management: Heat dissipation for power electronics, LEDs, and lasers.
- Power Electronics Substrates: Power semiconductors, such as EV chargers.
- High-Frequency and Microwave Devices: Performance enhancement in RF and microwave components.
- High-Temperature Applications: Aerospace, automotive electronics, and sensors.
- Lasers and Optoelectronic Devices: Heat dissipation in lasers.
Aluminum Nitride Material Properties
Aluminum Nitride Material Grades
HMAN1000 is our standard high purity aluminium nitride with a thermal conductivity of 170 W/mK. This is the same thermal performance as our substrate material but offers the possibility of larger pieces in length/width and in thicknesses up to 30mm.
HMAN1000 has good coefficient of thermal expansion – matched to silicon and gallium nitride over wide temperature ranges.
HMAN100 Applications:
- High power insulators
- Laser components
- Water cooled heatsinks
- Power electronics
- Aerospace, medical and semiconductor components
HMAN1000S 170 W/mK is our standard high thermal conductivity substrate material, However, other high-performance grades are also available.
HMAN1000S Applications:
- Heat sinks
- Heat spreaders
- Laser heatsinks power rectifiers
- Aerospace, power electronics, rectifiers
HMAN2000 is one of our enhanced grades of aluminium nitride, offering all the mechanical performance of HMAN1000 with the enhanced benefits of 200 W/mK thermal conductance.
HMAN2000 Applications:
- Heat sinks
- Heat spreaders
- Laser heatsinks power rectifiers
- Aerospace, power electronics, rectifiers
HMAN3000 is one of our enhanced grades of aluminium nitride offering, all the mechanical performance of HMAN1000 with the enhanced benefits of 230 W/mK thermal conductance.
HMAN3000 Applications:
- Heat sinks
- Heat spreaders
- Laser heatsinks power rectifiers
- Aerospace, power electronics, rectifiers
HMAN4000 is one of our enhanced grades of aluminium nitride offering, all the mechanical performance of HMAN1000 with the enhanced benefits of 200 W/mK thermal conductance.
HMAN4000 Applications:
- Heat sinks
- Heat spreaders
- Laser heatsinks power rectifiers
- Aerospace, power electronics, rectifiers
Aluminum Nitride Ceramic Machining
Aluminum Nitride (AlN) ceramic machining is a precise process used to fabricate high-performance components from aluminum nitride materials. Machining aluminum nitride ceramics requires specialized equipment and techniques to handle their brittleness and hardness. Proper tooling and controlled environments are essential to avoid material damage and achieve the desired surface finish and dimensional accuracy. The common machining methods are as follows:
- Diamond Cutting: Diamond tools are used to achieve fine precision and smooth surface finishes, ideal for complex shapes.
- Laser Cutting: A non-contact method used for intricate shapes, with high precision and minimal thermal impact.
- Precision Grinding: Utilized to achieve fine tolerances and surface finishes. Requires special care to prevent cracking or chipping due to the ceramic’s brittleness.
- Wire EDM (Electrical Discharge Machining): A method often used for intricate cutting, especially for thin and complex geometries.
Aluminum Nitride Ceramic Packaging
Aluminum Nitride Ceramic products are typically packaged in vacuum-sealed bags to prevent moisture or contamination and wrapped with foam to cushion vibrations and impacts during transport, ensuring the quality of products in their original condition.
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