Aluminum Nitride Electrostatic Chuck
Aluminum Nitride Electrostatic Chuck
Aluminum Nitride Electrostatic Chuck is made from high performance aluminum nitride ceramic, possessing exceptional thermal conductivity, strong mechanical strength, and excellent resistance to plasma erosion. It is ideal for semiconductor wafer processing, thin film deposition, etching, etc. As a leading supplier and manufacturer of premium aluminum nitride products, we can supply high-quality aluminum nitride electrostatic chucks (AlN ESCs) with various specifications and competitive prices, offering customized solutions to meet specific requirements.
Or email us at sales@heegermaterials.com.Aluminum Nitride Electrostatic Chuck Sheet
| Reference Code: | HM2085 |
| Density: | 3.3 g/cm3 |
| Appearance: | Greyish White, Beige |
| Thermal Conductivity: | 170-230 W/m·K |
Aluminum Nitride Electrostatic Chuck
Aluminum Nitride Electrostatic Chuck (AlN ESC) is an advanced component designed to securely hold semiconductor wafers and substrates during various high-precision manufacturing processes. It offers excellent thermal conductivity, strong mechanical strength, and resistance to plasma erosion. Their electrostatic chucking capability ensures reliable wafer clamping without physical contact, reducing contamination risks and improving process efficiency. It is mainly used in semiconductor wafer processing, thin film deposition, and etching. Advanced Ceramics Hub can provide customized solutions in various specifications to meet diverse industrial and research applications.
Aluminum Nitride Electrostatic Chuck Advantages
- High processing consistency
- Strong resistance to plasma erosion
- High mechanical strength
- Customizable
Aluminum Nitride Electrostatic Chuck Applications
- Semiconductor Manufacturing: Aluminum Nitride Electrostatic Chucks (AlN ESCs) are widely used in semiconductor wafer processing, particularly in etching and chemical vapor deposition (CVD) processes. The high thermal conductivity of AlN helps maintain temperature stability, while the electrostatic chucking capability ensures the wafer is securely held in place without mechanical contact.
- Thin Film Deposition: In thin film deposition processes, such as sputtering or evaporation, AlN ESCs are used to stabilize the substrate and control its temperature. The electrostatic chucking helps ensure uniform deposition, leading to high-quality thin films.
- Precision Machining: AlN ESCs are used in precision machining and microelectronics, where a high level of control over the substrate’s position and temperature is essential.
- Plasma Etching: During plasma etching, AlN ESCs are used to hold substrates in place while ensuring that heat dissipation is efficient. This improves the quality of etching and protects the substrate from damage.
- LED and Solar Cell Manufacturing: AlN ESCs are used in producing light-emitting diodes (LEDs) and solar cells, where precise temperature control is crucial for optimizing the quality and performance of these devices.
Aluminum Nitride Material Properties
Aluminum Nitride Material Grades
HMAN1000 is our standard high purity aluminium nitride with a thermal conductivity of 170 W/mK. This is the same thermal performance as our substrate material but offers the possibility of larger pieces in length/width and in thicknesses up to 30mm.
HMAN1000 has good coefficient of thermal expansion – matched to silicon and gallium nitride over wide temperature ranges.
HMAN100 Applications:
- High power insulators
- Laser components
- Water cooled heatsinks
- Power electronics
- Aerospace, medical and semiconductor components
HMAN1000S 170 W/mK is our standard high thermal conductivity substrate material, However, other high-performance grades are also available.
HMAN1000S Applications:
- Heat sinks
- Heat spreaders
- Laser heatsinks power rectifiers
- Aerospace, power electronics, rectifiers
HMAN2000 is one of our enhanced grades of aluminium nitride, offering all the mechanical performance of HMAN1000 with the enhanced benefits of 200 W/mK thermal conductance.
HMAN2000 Applications:
- Heat sinks
- Heat spreaders
- Laser heatsinks power rectifiers
- Aerospace, power electronics, rectifiers
HMAN3000 is one of our enhanced grades of aluminium nitride offering, all the mechanical performance of HMAN1000 with the enhanced benefits of 230 W/mK thermal conductance.
HMAN3000 Applications:
- Heat sinks
- Heat spreaders
- Laser heatsinks power rectifiers
- Aerospace, power electronics, rectifiers
HMAN4000 is one of our enhanced grades of aluminium nitride offering, all the mechanical performance of HMAN1000 with the enhanced benefits of 200 W/mK thermal conductance.
HMAN4000 Applications:
- Heat sinks
- Heat spreaders
- Laser heatsinks power rectifiers
- Aerospace, power electronics, rectifiers
Aluminum Nitride Ceramic Machining
Aluminum Nitride (AlN) ceramic machining is a precise process used to fabricate high-performance components from aluminum nitride materials. Machining aluminum nitride ceramics requires specialized equipment and techniques to handle their brittleness and hardness. Proper tooling and controlled environments are essential to avoid material damage and achieve the desired surface finish and dimensional accuracy. The common machining methods are as follows:
- Diamond Cutting: Diamond tools are used to achieve fine precision and smooth surface finishes, ideal for complex shapes.
- Laser Cutting: A non-contact method used for intricate shapes, with high precision and minimal thermal impact.
- Precision Grinding: Utilized to achieve fine tolerances and surface finishes. Requires special care to prevent cracking or chipping due to the ceramic’s brittleness.
- Wire EDM (Electrical Discharge Machining): A method often used for intricate cutting, especially for thin and complex geometries.
Aluminum Nitride Ceramic Packaging
Aluminum Nitride Ceramic products are typically packaged in vacuum-sealed bags to prevent moisture or contamination and wrapped with foam to cushion vibrations and impacts during transport, ensuring the quality of products in their original condition.
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