Aluminum Nitride Surface Modification Powder
Aluminum Nitride Surface Modification Powder
Purity: 99%-99.9%
Particle Size: 30-120 μm, or customized
Aluminum Nitride Surface Modification Powder is a hydrophobic modified aluminum nitride product customized through a modification process. As a leading supplier and manufacturer of premium aluminum nitride products, we can supply high-quality aluminum nitride surface modification powders with various specifications and competitive prices, offering customized solutions to meet specific requirements.
Or email us at sales@heegermaterials.com.Aluminum Nitride Surface Modification Powder Data Sheet
Reference Code: | HM1911 |
Purity: | 99%-99.9% |
Particle Size: | 30-120 μm or customized |
CAS: | 24304-00-5 |
Melting Point: | 2200℃ |
Boiling Point: | 2249℃ |
Aluminum Nitride Surface Modification Powder
Aluminum Nitride Powder has poor stability and can be hydrolyzed in water at ambient temperature, resulting in a decrease in the thermal conductivity of the powder. We offer a range of modified aluminum nitride powders tailored to various applications. Choose the right modification based on your needs: silane modification for better resin compatibility or hydrolysis-resistant treatment for improved moisture resistance.
Aluminum Nitride Surface Modification Powder Specifications
Product | AlN Granulation Powder-1 | AlN Granulation Powder-2 | |
Average Particle Size (μm) | 40-60 | 8-15 | |
Sphericity | 40-60% | ≥98% | |
Y2O3 (wt%) | 3-4 | 4-5 | |
Impurity Content | Ca (ppm) | <30 | <50 |
Fe (ppm) | <15 | <20 | |
Si (ppm) | <40 | <50 | |
Apparent Density (g/cm3) | 0.8-1.0 | 0.8-1.0 | |
Hall Flow Rate (s/50g) | 80-100 | 80-100 | |
Recommended Sintering Temperature | 1750-1850 ℃ | ||
Note | Sintering additives can be formulated according to customer requirements. |
Aluminum Nitride Surface Modification Powder Morphology
Aluminum Nitride Surface Modification Powder Particle Size Distribution
Aluminum Nitride Surface Modification Powder Features
- High thermal conductivity
- Strong hydrolysis resistance
- Excellent hydrophobicity
- Narrow particle size distribution
Aluminum Nitride Powder Surface Modification Solutions
Tailor your aluminum nitride powder with specialized surface treatments to achieve optimal performance:
- Silane Coupling Agent Modification: Improves dispersion and bonding in polymer matrices (e.g., epoxy, silicone) for superior composite performance.
- Inorganic Hydrolysis Resistant Treatment: Provides long-term stability in humid or aqueous environments by preventing moisture degradation.
- Dual Modification (Silane + Hydrolysis Resistance): Combines enhanced resin compatibility with environmental protection for demanding applications.
Aluminum Nitride Surface Modification Powder Hydrolysis Testing
The unmodified AIN undergoes almost complete hydrolysis after 2 hours at 70°C, resulting in a strong, irritating ammonia odor and significant clumping at the bottom of the cup. In contrast, our modified product shows no ammonia odor and no clumping even after 72 hours of hydrolysis, with almost no signs of hydrolysis.
- Experimental Conditions: 30g of Aluminum Nitride, 300g of pure water, water temperature at 70°C.
- Experimental Method: The degree of hydrolysis is determined by observing the experimental phenomena and measuring the pH value of the solution.
Time (h) | 0 | 1.0 | 2.0 | 5.0 | 10.0 | 24.0 | 48.0 | 72.0 |
AlN Modified Powder (pH) | 5.6 | 5.7 | 5.7 | 5.8 | 5.9 | 6.1 | 6.15 | 6.15 |
AlN Unmodified Powder (pH) | 7.6 | 9.4 | 10.2 | 10.2 | 10.1 | 9.8 | 9.6 | 9.6 |
Aluminum Nitride Powder Solutions
Surface Modification Powder
Aluminum nitride surface modification powder addresses issues like poor stability and water hydrolysis at room temperature, producing a hydrophobic modified aluminum nitride product through a tailored modification process.
Aluminum Nitride Surface Modification Powder Applications
- Thermal Management: Used in electronic devices and components to improve heat dissipation due to its high thermal conductivity.
- Electrical Insulation: Employed in electrical and electronic industries as an insulating material with high electrical resistivity.
- LED Manufacturing: Applied in LED technology for heat spreaders and substrates to enhance the efficiency and lifespan of LEDs.
- Ceramic Composites: Incorporated into ceramic materials to improve mechanical strength and thermal stability.
- High-Performance Polymers: Used as an additive in polymer composites for enhanced thermal conductivity and mechanical properties.
- Microelectronics: Applied in microelectronics for advanced packaging materials, ensuring better heat conduction and electrical isolation.
Aluminum Nitride Surface Modification Powder Packaging
The Aluminum Nitride Granulation Powder is carefully placed in wooden cases or cartons with additional support from soft materials to prevent any shifting during transportation. This packaging method guarantees the integrity of the products throughout the delivery process.
Download
Get A Quote
We will check and get back to you in 24 hours.