Aluminum Nitride Surface Modification Powder

Aluminum Nitride Surface Modification Powder
Purity: 99%-99.9%
Particle size: 30-120 μm, or customize
Or email us at sales@heegermaterials.com.
Aluminum nitride powder data sheet for surface modification
|
Reference code: |
HM1911 |
|
Purity: |
99%-99.9% |
|
Particle Size: |
30-120 μm or customized |
|
CAS: |
24304-00-5 |
|
Melting Point: |
2200℃ |
|
Boiling point: |
2249℃ |
Aluminum nitride powder for surface modification
Aluminum nitride powder has poor stability and can hydrolyze in water at room temperature, resulting in a decrease in the powder’s thermal conductivity. We offer a range of modified aluminum nitride powders tailored to various applications. Choose the appropriate modification based on your needs: silane modification for improved resin compatibility or hydrolysis-resistant treatment for enhanced moisture resistance.
Specifications for aluminum nitride powder for surface modification
|
Reference code: |
HM1911 |
|
Purity: |
99%-99.9% |
|
Particle size: |
30-120 μm or customized |
|
CAS: |
24304-00-5 |
|
Melting point: |
24304-00-5 |
|
Boiling point: |
2249℃ |
Aluminum nitride powder for surface modification
Aluminum nitride powder has poor stability and can hydrolyze in water at room temperature, resulting in a decrease in the powder’s thermal conductivity. We offer a range of modified aluminum nitride powders tailored to various applications. Choose the appropriate modification based on your needs: silane modification for improved resin compatibility or hydrolysis-resistant treatment for enhanced moisture resistance.
Specifications for aluminum nitride powder for surface modification
Product |
AlN Granulation Powder-1 |
AlN Granulation Powder-2 |
|
Average particle size (μm) |
40-60 |
8-15 |
|
Sphericity |
40-60% |
≥98% |
|
And 2 or 3 (wt%) |
3-4 |
4-5 |
|
Impurity content |
Ca (ppm) |
<30 |
<50 |
Fe (ppm) |
<15 |
<20 |
|
Yes (ppm) |
<40 |
<50 |
|
Apparent density (g/cm 3 ) |
0.8-1.0 |
0.8-1.0 |
|
Hall flow rate (50g) |
80-100 |
80-100 |
|
Recommended sintering temperature |
1750-1850 ℃ |
||
Note |
Sintering additives can be formulated according to customer requirements. |
||
Morphology of aluminum nitride powder for surface modification
Particle size distribution of surface-modified aluminum nitride powder
Aluminum nitride powder for surface modification. Features
- High thermal conductivity
- High resistance to hydrolysis
- Excellent hydrophobicity
- Narrow particle size distribution
Surface modification solutions with aluminum nitride powder
Tailor your aluminum nitride powder with specialized surface treatments to achieve optimal performance:
- Silane coupling agent modification : Improves dispersion and bonding in polymer matrices (e.g., epoxy, silicone) for superior compound performance.
- Inorganic Hydrolysis-resistant treatment : Provides long-term stability in humid or aqueous environments by preventing degradation from moisture.
- Dual modification (Silane + Hydrolysis resistance) : Combines greater resin compatibility with environmental protection for demanding applications.
Surface modification of aluminum nitride. Powder hydrolysis tests.
Unmodified NAI undergoes almost complete hydrolysis after 2 hours at 70°C, resulting in a strong, irritating ammonia odor and the formation of clumps at the bottom of the container. In contrast, our modified product shows no ammonia odor or clumping even after 72 hours of hydrolysis, with virtually no signs of further hydrolysis.
- Experimental conditions: 30g of Aluminum Nitride, 300g of pure water, water temperature at 70°C.
- Experimental method: The degree of hydrolysis is determined by observing the experimental phenomena and measuring the pH of the solution.
|
Time (h) |
0 |
1.0 |
2.0 |
5.0 |
10.0 |
24.0 |
48.0 |
72.0 |
|
AlN modified powder (pH) |
5.6 |
5.7 |
5.7 |
5.8 |
5.9 |
6.1 |
6.15 |
6.15 |
|
Unmodified AlN Powder (pH) |
7.6 |
9.4 |
10.2 |
10.2 |
10.1 |
9.8 |
9.6 |
9.6 |
Aluminum nitride powder solutions
Applications of aluminum nitride powder for surface modification
- Thermal management: It is used in electronic devices and components to improve heat dissipation thanks to its high thermal conductivity.
- Electrical insulation: It is used in the electrical and electronics industry as an insulating material with high electrical resistivity.
- LED Manufacturing: It is applied in LED technology for heat sinks and substrates in order to improve the efficiency and lifespan of the LEDs.
- Ceramic composites: Incorporated into ceramic materials to improve mechanical strength and thermal stability.
- High-performance polymers: It is used as an additive in polymer compounds to improve thermal conductivity and mechanical properties.
- Microelectronics: It is applied in microelectronics for advanced packaging materials, ensuring better heat conduction and electrical insulation.
Electronic Packaging Material
Thermal conductive filling
3D printing and additive manufacturing
Electronic packaging material
Aluminum nitride Surface modification Powder packaging
The granulated aluminum nitride powder is carefully placed in wooden or cardboard boxes with additional soft padding to prevent any movement during transport. This packaging method ensures the integrity of the products throughout the delivery process.

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